Central Midori's Technology Blog

Through-Hole Printing vs. Through-Hole Plating

In the manufacturing of Printed Circuit Board, through hole plating remains a complex operation. It involves wet chemical processes including deposition of metals by metallization and electroplating techniques. Although direct metallization has contributed to reduce the number of steps and chemicals involved in the process, it is still the source of a lot of anguish among the engineering community.

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